IBM has designed new powerful chips for the digital market.
International Business Machines (IBM) Corporation has introduced new chips. IBM news reported that the corporation proclaimed on Thursday that it has developed working editions of ultra-dense computer processors. The capacity of the new high tech devices would be four times greater than today’s most powerful chips. The proclamation was made on the behalf of an international group led by the IBM enterprise, which has invested $3,000,000,000 in a joint venture with Samsung, Global Foundries, and New York State, and equipment vendors.
IBM news today informed that the tie up has been carried out to develop technologically advanced processing devices in New York’s Hudson Valley. The development has contributed to the chip manufacturing industry, which has failed to double transistor density in every two years. Technical issues have challenged the Intel Corporation, which historically has been known for leading the industry. Each phase of processing technology is described by the minimum size of the basic parts that switch current at nanosecond intervals.
The corporation has stated that it had created samples of performing chips with seven nanometer transistors. Instead of using silicon, it has used silicon germanium, which is known for speeding up the process which transistor carries out switching. IBM has claimed that it would try to design microprocessors with more than 20,000,000,000 transistors, reports IBM breaking news.
Press sources indicated that Director of the Robust Systems Group in the Electrical Engineering Department at Stanford University, Subhashish Mitra, has welcomed the development by stating that he is not surprised as this is what was expected. Experts are of the view that the announcement tends to inform that it wants to contribute to the state’s chip development base. The digital enterprise has refused to answer the question regarding the duration when it might start to produce the new devices commercially.
The Taiwan Semiconductor Manufacturing Company (TMSC) is also interested in pioneering the highly advanced chips, as it intends to introduce them in 2017. Unlike the corporation, TMSC has failed to exhibit working chips to achieve that objective. Commercial sources highlighted that up till now, the semiconductors have been demonstrated in a research lab. The final objective of the company is to develop circuits that have covered a smaller area.
Industry experts believe that the technical innovation would help to improve the business reputation. IBM’s management should now speed up the process of commercial manufacturing of devices; otherwise, it might fail to revolutionize the digital world.
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